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PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards

Shenzhen SMTfly Electronic Equipment Manufactory Limited
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    Buy cheap PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards from wholesalers
     
    Buy cheap PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards from wholesalers
    • Buy cheap PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards from wholesalers
    • Buy cheap PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards from wholesalers
    • Buy cheap PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards from wholesalers
    • Buy cheap PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards from wholesalers

    PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards

    Ask Lasest Price
    Brand Name : ChuangWei
    Model Number : CWVC-5S
    Certification : CE
    Price : Negotiable
    Supply Ability : 50 sets per month
    Delivery Time : 5-7 days
    • Product Details
    • Company Profile

    PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards

    PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards Laser PCB Separator Advantages

    • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
    • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
    • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
    • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
    • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.


    Laser PCB Separator Machine Principle



    Laser PCB Separator Parameter

    Parameter







    Technical parameters

    Main body of laser1480mm*1360mm*1412 mm
    Weight of machine1500Kg
    PowerAC220 V
    Laser355 nm
    Laser

    Optowave 10W(US)

    Material≤1.2 mm
    Precisio±20 μm
    Platfor±2 μm
    Platform±2 μm
    Working area450*430 mm
    Maximum3 KW
    VibratingCTI(US)
    PowerAC220 V
    Diameter20±5 μm
    Ambient20±2 ℃
    Ambient<60 %
    The MachineMarble


    Laser PCB Separator Features

    1. Neat and smooth edge, no burr or overflow
    2. More quick and easy, shorten the delivery time
    3. High quality ,no distortion,surface clean& uniformity
    4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed.

    Product Photos





    Our Service


    # 1 day delivery
    # 24 hours fast response
    # Largest manufactory in South China
    # 100% responsible for quality
    # 14 years experience
    # 1 year warranty
































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    Quality PCB Laser Cutting Machine PCB Depaneling with ±20 μm Precision for FR4 PCB Boards for sale
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