PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

• Pre-camera vision product position registration and model check
• Coherent Avia NX UV laser with HurrySCAN head
• High capacity BOFA dust collector
• User friendly Window based software
• PCB flexible product jig adjustable for different board size
• High resolution and accurate Z stage with auto-focus function
• Large area low friction front loading platform for sliding multiple product jigs
• Fully covered class 1 safety enclosure
• Able to do cutting and marking together
• Compact size